• Diamond Metal Bond Grinding Segment for Floor Surface
  • Diamond Metal Bond Grinding Segment for Floor Surface
  • Diamond Metal Bond Grinding Segment for Floor Surface
  • Diamond Metal Bond Grinding Segment for Floor Surface
  • Diamond Metal Bond Grinding Segment for Floor Surface
  • Diamond Metal Bond Grinding Segment for Floor Surface

Diamond Metal Bond Grinding Segment for Floor Surface

Blade Type: Cutter Head
Manufacturing Process: Sintered
Application: Concrete
Material: Diamond Metal Powder
Classification: Grinding Tools
Transport Package: Carton Box
Customization:
Gold Member Since 2017

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Manufacturer/Factory

Basic Info.

Model NO.
BSD
Specification
12
Trademark
BSD
Origin
China
HS Code
8207
Production Capacity
5000

Product Description

Diamond Metal Bond Grinding Segment for Floor Surface

6# 16# 36# 60# Aggrasivev HTC Metal Bond Segment Diamond Abrasive Grinding Polishing Pad  For Granite concrete floor Surface Grinder

1. Grinding  segments  are  used for grinding concrete, terrazzo, stone floors .  welded on metal  plate, fixed on Multi-functional floor grinding machine and stone refurbished machine . 

2. When grinding hard concrete ,diamond segment bond needs to match the concrete hardness  .

3. Grits: 6# - 400#

4. Size of segment:  Dia.20*10mm, Dia.25.4*8mm, Dia.25.4*10mm , 2 segments

5. Major market: USA, Canada, Austrialia,  Iran, Turkey, Jordan, Vietnam, China, etc.  

6. 100% produced in our own factories,

Our Metal Bond Discs are specially designed for polishing and grinding concrete, granite, marble, limestone, travertine and terrazzo, 

 

 For   Concrete, stone and terrazzo
  Segment Height   10mm
  Grit   16#, 30#-220#, 350/400#
  Bond   Very soft to Xtreme hard
  Fit Machine   HTC Grinder



Diamond Metal Bond Grinding Segment for Floor Surface

Diamond Metal Bond Grinding Segment for Floor Surface

Diamond Metal Bond Grinding Segment for Floor Surface


Diamond Metal Bond Grinding Segment for Floor Surface
Diamond Metal Bond Grinding Segment for Floor Surface



Diamond Metal Bond Grinding Segment for Floor Surface




 


 






 

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Gold Member Since 2017

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Manufacturer/Factory
Registered Capital
500000 RMB
Plant Area
101~500 square meters